Power chips are attached to outside circuits through product packaging, and their efficiency relies on the support of the packaging. In high-power scenarios, power chips are normally packaged as power components. Chip interconnection refers to the electrical connection on the top surface of the chip, which is normally light weight aluminum bonding cord in typical components. ^
Typical power component bundle cross-section
Today, industrial silicon carbide power modules still mostly use the packaging modern technology of this wire-bonded traditional silicon IGBT module. They deal with issues such as big high-frequency parasitical specifications, inadequate warmth dissipation capacity, low-temperature resistance, and not enough insulation stamina, which restrict using silicon carbide semiconductors. The screen of exceptional performance. In order to solve these troubles and completely manipulate the big prospective advantages of silicon carbide chips, several brand-new product packaging innovations and remedies for silicon carbide power components have emerged in recent years.
Silicon carbide power module bonding method
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding products have actually created from gold cable bonding in 2001 to aluminum wire (tape) bonding in 2006, copper wire bonding in 2011, and Cu Clip bonding in 2016. Low-power gadgets have created from gold wires to copper wires, and the driving pressure is price reduction; high-power tools have created from aluminum cords (strips) to Cu Clips, and the driving pressure is to improve product efficiency. The better the power, the higher the needs.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging procedure that makes use of a solid copper bridge soldered to solder to link chips and pins. Compared to typical bonding packaging approaches, Cu Clip technology has the adhering to benefits:
1. The connection in between the chip and the pins is constructed from copper sheets, which, to a certain extent, replaces the conventional cable bonding method in between the chip and the pins. Therefore, a special plan resistance value, higher present flow, and much better thermal conductivity can be acquired.
2. The lead pin welding area does not need to be silver-plated, which can completely save the expense of silver plating and bad silver plating.
3. The item appearance is totally constant with normal products and is primarily utilized in servers, portable computer systems, batteries/drives, graphics cards, electric motors, power supplies, and other areas.
Cu Clip has two bonding approaches.
All copper sheet bonding approach
Both eviction pad and the Source pad are clip-based. This bonding approach is more pricey and intricate, however it can accomplish better Rdson and better thermal impacts.
( copper strip)
Copper sheet plus cable bonding method
The source pad makes use of a Clip approach, and the Gate utilizes a Cable method. This bonding method is somewhat cheaper than the all-copper bonding technique, saving wafer location (applicable to really little gateway locations). The procedure is easier than the all-copper bonding method and can acquire far better Rdson and much better thermal result.
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